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Chip Quik CQB Gold Bonding Wires
02/07/2025
02/07/2025
High-purity gold >99.99% is designed specifically for wire bonding.
Chip Quik TS & WS Series Solder Paste Cartridges
12/27/2024
12/27/2024
Designed using high-quality synthetic flux and precision atomized metal powder.
Chip Quik Solder Wire
02/12/2024
02/12/2024
Available in various flux-core options and numerous alloy configurations.
Chip Quik Sn95.5/Ag4.0/Cu0.5 Solder Spheres for BGAs
09/06/2023
09/06/2023
Manufactured from virgin materials to meet or exceed the requirements of a building.
Chip Quik Indium Solder Ribbon (In52/Sn48)
09/05/2023
09/05/2023
Features 11.9N/mm2 (at 20°C) tensile strength and 118°C (244°F) melting point.
Chip Quik Sn60/Pb40 BGA Solder Sphere
03/20/2023
03/20/2023
Featuring a 0.76mm diameter and a 183°C to 188°C melting point range.
Viendo: 1 - 7 de 7
Chip Quik CQB Gold Bonding Wires
02/07/2025
02/07/2025
High-purity gold >99.99% is designed specifically for wire bonding.
Chip Quik TS & WS Series Solder Paste Cartridges
12/27/2024
12/27/2024
Designed using high-quality synthetic flux and precision atomized metal powder.
Chip Quik Solder Wire
02/12/2024
02/12/2024
Available in various flux-core options and numerous alloy configurations.
Chip Quik Sn95.5/Ag4.0/Cu0.5 Solder Spheres for BGAs
09/06/2023
09/06/2023
Manufactured from virgin materials to meet or exceed the requirements of a building.
Chip Quik Indium Solder Ribbon (In52/Sn48)
09/05/2023
09/05/2023
Features 11.9N/mm2 (at 20°C) tensile strength and 118°C (244°F) melting point.
Chip Quik Sn60/Pb40 BGA Solder Sphere
03/20/2023
03/20/2023
Featuring a 0.76mm diameter and a 183°C to 188°C melting point range.
Apex Tool Group Weller® WSW Solder Wire
05/26/2022
05/26/2022
100% continuous flux core with no air inclusions & pure first metal melting for long-term results.
MG Chemicals 4860P Sn63/Pb37 Solder Paste No-Clean
05/20/2022
05/20/2022
No-clean 63/37 non-recycled leaded solder paste.
Viendo: 1 - 9 de 9
